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NTD65N03R
Power MOSFET
25 V, 65 A, Single N?Channel, DPAK
Features
? Low R DS(on)
? Ultra Low Gate Charge
? Low Reverse Recovery Charge
? Pb?Free Packages are Available
Applications
? Desktop CPU Power
? DC?DC Converters
? High and Low Side Switch
V (BR)DSS
25 V
http://onsemi.com
R DS(on) TYP
6.5 m W @ 10 V
9.7 m W @ 4.5 V
N?Channel
I D MAX
65 A
D
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain?to?Source Voltage
Gate?to?Source Voltage
V DSS
V GS
25
" 20
V
V
G
Continuous Drain
Current (R q JC ) Limited
by Die
T C = 25 ° C
T C = 85 ° C
I D
65
45
A
S
Continuous Drain
Current (R q JC ) Limited
by Wire
Power Dissipation
(R q JC )
Continuous Drain
Current (Note 1)
Power Dissipation
Steady
State
Steady
State
T C = 25 ° C
T C = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
I D
P D
32
50
11.4
8.9
1.88
A
W
A
W
4
1 2
3
CASE 369AA
DPAK
(Bend Lead)
4
1
2
3
CASE 369D
DPAK
(Straight Lead)
4
1
2 3
CASE 369AC
3 IPAK
(Straight Lead)
(Note 1)
STYLE 2
STYLE 2
Continuous Drain
T A = 25 ° C
I D
9.5
A
Current (Note 2)
Power Dissipation
Steady
State
T A = 85 ° C
T A = 25 ° C
P D
7.4
1.3
W
MARKING DIAGRAMS
& PIN ASSIGNMENTS
(Note 2)
Pulsed Drain Current
t p = 10 m s
I DM
130
A
4
Drain
Operating Junction and Storage
Temperature
Drain?to?Source (dv/dt)
Source Current (Body Diode)
Single Pulse Drain?to?Source Avalanche
T J , T stg
dv/dt
I S
E AS
?55 to
175
2.0
2.1
71.7
° C
V/ns
A
mJ
4
Drain
Energy (V DD = 24 V, V GS = 10 V, I L = 12 A,
L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
1
Gate
2
Drain
3
Source
1
Gate
2
Drain
3
Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface?mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
Y
WW
65N03
G
= Year
= Work Week
= Device Code
= Pb?Free Package
2. Surface?mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.15 in sq) [1 oz] including traces.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2006
July, 2006 ? Rev. 3
1
Publication Order Number:
NTD65N03R/D
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